Samsung vs. LG battle for AI cooling heats up

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Samsung Electronics and LG Electronics are scaling up their data-center cooling businesses as power-hungry AI chips turn heat management into a critical infrastructure bottleneck.…

Crosstown rivals expand overseas production as liquid cooling becomes critical to data-center growth

Samsung Electronics and LG Electronics are scaling up their data-center cooling businesses as power-hungry AI chips turn heat management into a critical infrastructure bottleneck.

Data centers have traditionally relied on air cooling. But advanced artificial intelligence accelerators and increasingly dense server racks are pushing those systems toward their practical limits. Nvidia’s B200 and other next-generation chips consume more than 1,000 watts each, accelerating the shift toward liquid cooling.

In direct-to-chip systems, cold plates draw heat from processors and coolant carries it through a coolant distribution unit, or CDU, to a chiller.

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