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Banks Eye $21 Billion of Bonds For Broadcom Chip-Financing Deal

نشره Bloomberg · الولايات المتحدة منذ 1 س

Banks are planning to sell as much as about $21 billion of high-grade bonds as soon as early next year as part of a $63 billion funding package that Broadcom Inc. has pulled…

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Banks Eye $21 Billion of Bonds For Broadcom Chip-Financing Deal

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