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South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment

Published by CNA · Singapore 18 min ago
FILE PHOTO: A Samsung Electronics logo and a computer motherboard appear in this illustration taken August 25, 2025. REUTERS/Dado Ruvic/Illustration/File Photo
FILE PHOTO: A Samsung Electronics logo and a computer motherboard appear in this illustration taken August 25, 2025. REUTERS/Dado Ruvic/Illustration/File Photo · CNA

Detailed summary

SEOUL, Nov 12 : South Korean President Lee Jae Myung said on Thursday that Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.

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